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1 | | | printed circuit board (pcb)
Specification: Single Side PCB
Detail: Layers: 1L Material: TG 130 Thickness of finished plate: 1.2mm Minute trace width/***cing: 0.3 mm/ 0.3 mm Surface treatment: OSP Application: Household appliances
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2 | | | printed circuit board (pcb)
Specification: Multi Layers PCB
Detail: Layers: 6L Material: Normal TG150 Thickness of finished plate: 1.6mm Minimum aperture: 0.15mm Minute cable width/***cing: 0.075mm/ 0.075mm Surface Treatment: Immersion Gold 2 ¡ä Applic...
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3 | | | printed circuit board (pcb)
Specification: VOP PCB
Detail: Layers: 6L Material: Normal TG150 Thickness of finished plate: 1.0mm Minimum aperture: 0.15mm Minute cable width/***cing: 0.075mm/ 0.075mm Surface Treatment: Immersion Gold 2" Product ...
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4 | | | printed circuit board (pcb)
Specification: VOP PCB
Detail: Layer: 4 L Material: Medium TG150 Thickness of finished plate: 1.6mm Minute aperture: 0.2mm Minimum cable width/***cing: 0.08mm/0.07 mm Surface Treatment: Immersion Gold 2" Impedance c...
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5 | | | printed circuit board (pcb)
Specification: VOP PCB
Detail: Layer:6L Material:Height-TG180 Finished Board Thickness:1.2 mm Minute aperture: 0.15mm Minute cable width/***cing: 0.075mm/ 0.075mm Surface Treatment: Immersion Gold 2" Vias In Pads with resin plu...
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6 | | | printed circuit board (pcb)
Specification: Double Sides PCB
Detail: Layer :2L Material: FR4 (CTI>600) Finished Board Thickness:1.6mm Minimum Hole Dia. : 0.35mm Minimum Line ***cing :0.125mm/0.125mm Finish: Lead-free tin spray Application: Acoustic equipment
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7 | | | printed circuit board (pcb)
Specification: High Density Interconnect PCB
Detail: Layer :4L HDI Material: FR4 (Tg150) Finished Board Thickness:1.2mm Minimum Hole Dia.: 0.2mm Minimum Line ***cing :0.08mm/0.07mm Surface Treatment :Immersion 2U" Product features: Impedance control Appl...
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8 | | | printed circuit board (pcb)
Specification: High Density Interconnect
Detail: Layer :6L 2+N+2HDI Material: FR4 (Tg180) Finished Board Thickness:1.6mm Minimum Hole Dia.: 0.1mm (Laser drill) Minimum Line ***cing :0.075mm/0.075mm Surface Treatment :Immersion 2U" Features: Laser drilling, ...
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9 | | | printed circuit board (pcb)
Specification: High Density Interconnect
Detail: Layer:4L HDI Material: FR4 (Tg180) Finished Board Thickness :1.0mm Minimum Hole Dia. : 0.1mm (Laser drill) Minimum ***cing:0.075mm/0.075mm Surface Treatment :Immersion Gold 2U" Features: Laser drilling, imped...
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10 | | | printed circuit board (pcb)
Specification: High Density 4Layers PCB
Detail: Layer :6Layers Material: HighTG170 Finished Board Thickness :1.6mm Minumum Hole Dia.: 0.2mm Minimum Line ***cing:0.08mm/0.065 Surface Treatment :Immersion Gold 2" Features: Impedance control,BGAsize0.25mm ...
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